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Battle Creek, MI

 

The µ-LAM process provides an effective technique for machining nominally hard and brittle semiconductor and ceramic materials, without fracture, through a combination of generating a ductile high pressure phase (via the HPPT) and then heating and thermally softening the transformed material with the laser energy, rendering it more ductile/pliable (plastic) and less brittle. Not only can fracture free surfaces (free of subsurface cracks also) be generated, but other surface and subsurface damage can be minimized or eliminated altogether.

 

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